Please note that this article cites information from Nikkei and Rix. As semiconductor giants like TSMC accelerate development and capacity expansion for 2.5D and 3D packaging technologies such as CoWoS, a new business opportunity is emerging for chipmaking tool companies. According to Nikkei, Jap...

Please note that this article cites information from Financial Times and Nikkei. Amid rising geopolitical uncertainty, Japan’s leading MLCC supplier is reportedly moving to decouple its rare earth supply chains between the U.S. and China. According to Financial Times, Apple supplier Murata Manufa...

Please note that this article cites information from TechNews, The Elec, and Kioxia. As memory giants restructure capacity amid tight supply, Japan’s Kioxia joins the wave, with a client notice indicating it will discontinue Thin Small Outline Package (TSOP) products, final shipments set for Ma...

Please note that this article cites information from imec, Reuters, Intel, SK hynix, Korea Economic Daily, Bloomberg, and The Elec. Belgian chip research institute imec announced that it has received an ASML tool that could advance next-generation chipmaking. According to its press release, imec ...

Please note that this article cites information from Samsung, Chosun Biz, and Yonhap News. AMD has secured HBM4 supply from Samsung, but the deal reportedly includes a key condition that could benefit Samsung’s foundry business. Samsung is expected to supply HBM4 for AMD’s Instinct MI455X GPU...