TSMC is reportedly moving to accelerate advanced U.S. chip production. According to Nikkei, sources say the company plans to begin moving chipmaking equipment into its second Arizona plant around the summer of 2026, setting the stage for 3nm manufacturing in 2027. Sources cited by the report say ...

At its December 18 earnings call, Micron reportedly acknowledged that it is currently able to meet only around 55%–60% of core customer demand, while warning that the memory supply crunch is likely to persist beyond 2026. Here’s a closer look at the factors driving the tight supply, the ripple e...

While Micron confirmed at its earnings call that it has sampled its 192GB LP SOCAMM2, other memory leaders are ramping up their efforts. Yonhap News reports that Samsung has also developed SOCAMM2, an LPDDR-based server memory module, and has already delivered samples to AI powerhouse NVIDIA, with s...

China’s long journey toward domestic EUV lithography capability appears to be narrowing, as recent developments point to faster-than-expected progress. According to Reuters, sources say China has assembled a prototype EUV machine using components sourced from older ASML systems. As the report i...

Amid tight supply across both mainstream products and high-end memory such as HBM, Micron sailed through its latest earnings call, posting record results across the board. The company said its 1QFY26 (ended November 27) total revenue—spanning DRAM, NAND, HBM, data center, and every business unit�...