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2025-12-18

[News] SOCAMM2 War Heats Up: Samsung Reportedly Delivers Samples to NVIDIA, Ramping Early 2026

While Micron confirmed at its earnings call that it has sampled its 192GB LP SOCAMM2, other memory leaders are ramping up their efforts. Yonhap News reports that Samsung has also developed SOCAMM2, an LPDDR-based server memory module, and has already delivered samples to AI powerhouse NVIDIA, with s...

2025-12-18

[News] China Reportedly Builds EUV Prototype Using Older ASML Components, Eyes 2028 Chipmaking

China’s long journey toward domestic EUV lithography capability appears to be narrowing, as recent developments point to faster-than-expected progress. According to Reuters, sources say China has assembled a prototype EUV machine using components sourced from older ASML systems. As the report i...

2025-12-18

[News] Micron Hikes CapEx to $20B with 2026 HBM Supply Fully Booked; HBM4 Ramps 2Q26

Amid tight supply across both mainstream products and high-end memory such as HBM, Micron sailed through its latest earnings call, posting record results across the board. The company said its 1QFY26 (ended November 27) total revenue—spanning DRAM, NAND, HBM, data center, and every business unit...

2025-12-18

[News] Apple Reportedly to Bring WMCM Packaging to A20 Series, Boosting iPhone 18 Thermal Efficiency

Apple’s iPhone 18 is already drawing industry attention, with rumors around its chip packaging further raising expectations. According to Wccftech, citing Weibo tipster Fixed Focus Digital, Apple may shift from InFO (Integrated Fan-Out) to WMCM (Wafer-level Multi-Chip Module) packaging for its A20...

2025-12-18

[News] Meta Reportedly Taps Korea’s Sapien Semiconductors for Micro LED AR Glasses Backplanes

Meta is advancing its push into AR glasses, with South Korean component suppliers reportedly poised to benefit. According to Business Korea, citing sources, South Korea’s Sapien Semiconductors is expected to supply backplanes—chips that control Micro LED pixels—for Meta’s Micro LED (LEDoS)-b...

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