[News] SK hynix Reportedly Weighs Intel for HBM4E Base Dies amid TSMC Cost Pressure and Supply Diversification

As Intel pushes to expand its foundry footprint beyond its own chips—from advanced packaging (EMIB) to logic manufacturing—memory makers may be exploring a similar diversification away from TSMC. With the base die becoming a key differentiator in the HBM4 era, SK hynix is reportedly considering Intel Foundry for part of its base-die production starting with HBM4E, according to Herald Business.

The move, if confirmed, could also help ease mounting cost pressures. Herald Business estimates that TSMC’s HBM4 base dies could already cost 3–4 times more than SK hynix’s core dies built on its 1b process, with the gap expected to widen for HBM4E.

Passing those higher foundry costs on to customers, however, could prove difficult given the high share of long-term supply agreements (LTAs) in HBM. Bringing Intel into the base-die supply chain could therefore give SK hynix greater flexibility in managing costs while improving supply stability, the report adds.

SK hynix produced base dies in-house through HBM3E, but turned to TSMC for HBM4 as the dies took on greater logic and performance demands, Herald Business explains, adding that its HBM4, now in mass production, uses base dies made on TSMC’s 12nm-class process.

Beyond manufacturing, SK hynix is also expanding its base-die design capabilities. According to NewsPim, SK hynix America operates an HBM Architect Design Team in San Jose, California, working directly with major U.S. customers on base-die designs for HBM and 3D-stacked DRAM.

Responding to the Herald Business report, SK hynix said it was difficult to confirm details related to its technology roadmap and that “some of the reports are not true.”

Base Die: The New HBM Battleground

Interestingly, Business Post notes that if Intel proves it can deliver HBM base dies to SK hynix at competitive yields and costs, Samsung Electronics and Micron could also consider tapping Intel.

Either way, base dies are emerging as a key focus for memory makers. S-Journal notes that Samsung manufactures HBM4 base dies in-house on its 4nm foundry process, integrating the core DRAM, logic die and advanced packaging.

Notably, strong demand for HBM base dies is already lifting Samsung’s foundry business. The company said in its July 30 earnings release that rising HBM4 shipments and stronger demand for HBM base dies from customers in the Americas helped improve foundry revenue and performance.

Micron, by contrast, continues to use 1-beta DRAM for HBM4 memory dies and is expected to move to 1-gamma DRAM with HBM4E. Like SK hynix, its logic dies for both standard and custom HBM4E are also expected to be manufactured by TSMC.

Read more

• [News] SK hynix Breaks Ground on Indiana Packaging Plant, Eyes HBM4E by 3Q29; CEO Sees Tight Supply Through 2030
• [News] SK hynix Ships 12-High HBM4E Samples, Boosts Bandwidth to 16Gbps and Power Efficiency by Over 20%

(Photo credit: SK hynix)