Yearly Archives: 2025

[News] Sony Reportedly Mulls Chip Division Spinoff and Listing to Strengthen Entertainment Focus

Posted on 2025-04-29 by TrendForce

According to Bloomberg, sources indicate that Sony Group is weighing the spin-off of its semiconductor subsidiary, Sony Semiconductor Solutions, with an IPO potentially taking place as early as this year. Another report from Bloomberg adds that the move would mark the …

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[News] China’s NAND Giant YMTC Reportedly Lost Over $11M in First Nine Months of 2024 Amid Heavy Spending

Posted on 2025-04-29 by TrendForce

YMTC, known for its hybrid bonding patent deal with Samsung and its push toward 294-layer NAND production, has quietly revealed mounting losses. Financial disclosures tied to an investment by Hebei Yangyuan Zhihui Beverage Co showed that YMTC posted an 84 …

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[News] Indian Research Team Submits Angstrom-Scale Chip Proposal

Posted on 2025-04-29 by TrendForce

It’s reported that a team of 30 scientists from the Indian Institute of Science (IISc) has submitted a proposal to the government to develop Angstrom-scale chips, which will leverage new semiconductor technologies based on two-dimensional (2D) materials. The proposal suggests …

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[News] Intel Expands Foundry Ecosystem With TSMC, UMC, and Taiwanese IP Partners

Posted on 2025-04-29 by TrendForce

Intel’s new CEO, Lip-Bu Tan, has just completed his first earnings call, demonstrating a strong commitment to driving the company’s transformation. As noted by a report from Commercial Times, Intel’s next-generation CPU, Nova Lake, will combine in-house production with outsourcing …

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[News] The TC Bonder Dispute: Is Hybrid Bonding for 16Hi HBM the Spark Behind the Hanmi-SK hynix Rift?

Posted on 2025-04-28 by TrendForce

Amid growing tensions with its longtime TC bonder supplier Hanmi Semiconductor, SK hynix is reportedly taking things a step further. According to Financial News, the HBM leader has started reviewing a full diversification of all Hanmi-supplied equipment—not just TC bonders. …

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