Indium phosphide (InP) is becoming an increasingly important material for photonics in next-generation AI data centers, where supply remains tight. According to Nikkei, JX Advanced Metals plans to increase its InP substrate production capacity by up to tenfold. The company intends to invest a total ...

AMD has acquired MEXT, a startup developing memory optimization technology aimed at easing data center memory bottlenecks. According to Tom’s Hardware, AMD announced on June 15 that it had acquired MEXT, whose memory tiering technology allows NAND flash to function as DRAM from the operating syste...

As Samsung accelerates efforts to secure 2nm customers, it is taking the next step in its MPW strategy. Citing Samsung Foundry Executive Director Song Tae-jung, ZDNet reports that the company’s MPW services are expected to extend to the 2nm node in 2027. iNews24 notes this is the first time Sam...

While smartphone form factors and thermal constraints have limited HBM adoption, Chinese smartphone brands are reportedly exploring HBM-inspired memory architectures. According to Wccftech, citing Weibo tipster Fixed-focus Digital, Xiaomi and Huawei may be planning to introduce custom Low Latency Wi...

TSMC Chairman C.C.Wei, as reported by the Economic Daily News, reaffirmed at the shareholders’ meeting in early June that a CoPoS (Chip-on-Panel-on-Substrate) pilot line is already in place, with mass production expected in 2–3 years—keeping the company’s panel-level packaging push in focus....