"TSMC's North America Technology Symposium unveiled a roadmap for advanced packaging solutions, showcasing the 3DFabric® platform, which includes wafer level 3D stacking and advanced packagi...
"According to the latest supply chain survey from TrendForce, new US export regulations starting in April 2025 will require licenses for exporting semiconductor chips like NVIDIA H20 and AMD...
"TrendForce's 2024 OSAT report highlights packaging's rising importance due to Moore's Law limits and chip complexity. Asian firms dominate, with Taiwan maintaining...
Since Donald Trump's first election as President of the United States, the US has consistently and systematically employed various policy tools to strictly limit China’s access to advance...
TrendForce reports explosive AI computing demand drives CSPs to accelerate in-house ASIC development for cost control and competitiveness. Global AI server shipments are projected ~25% YoY growth in 2...
"TrendForce reports the US now requires export licenses for AI chips like NVIDIA's H20 and AMD's MI308 to China, effective immediately. This forces NVIDIA and AMD to recogni...
Geopolitical instability has fostered the rising consciousness of sovereign AI in 2025, thus prompting the US, Europe, China, and Japan to successively revitalize their domestic chip industries. These...
"TrendForce reports US tariff policy shifts are impacting the memory market. A 90-day grace period announced in April spurred a Q2 surge in DRAM and NAND Flash orders as buyers and sellers rushed...
"TrendForce reports that the introduction of new US tariffs, particularly the 20% ""fentanyl tariff"" on China-made goods, has significantly disrupted the smartphone industry,...
TrendForce reports Mexico remains a key location for server and AI production, particularly for US-bound orders, leveraging USMCA exemptions despite US tariff volatility. The new policy favors USMCA-c...
"TrendForce reports new US ""reciprocal tariffs"" suppress investment and consumer demand, prompting a downward revision of the 2025 global end-product out...
As the global market expands its investment in AI computing and the development of related applications, humanoid robots are expected to become the largest AI application by market size. The introduct...
"TrendForce reports NVIDIA announced next-gen B300, Rubin, and Vera at GTC 2025, emphasizing memory, liquid-cooling, and CPO network advancements, shifting from GB NVL72 to VR NVL144 and Rubin Ul...
"TrendForce reports TSMC's recent CoWoS capacity adjustment is due to prior customer overbooking, but CSP demand remains largely unchanged. 2025 CoWoS total demand is...
"TrendForce reports AI drives higher NAND Flash transmission performance demands. Samsung, to seize AI edge computing opportunities, accelerates Hybrid Bonding adoption in its V9 (286L) produ...
