IC Testing & Packaging

CoWoS Expected at Twofold Growth in 2025 from Demand of Blackwell and CSPs’ ASICs; Progress to Depend on Supply Expansions and Preparation of GB Racks

TrendForce forecasts that CoWoS capacity will double in 2025, driven by demand for Blackwell and CSPs' ASICs. TSMC, the major supplier, will expand capacity to meet the demand, with N...

CoWoS Expected at Twofold Growth in 2025 from Demand of Blackwell and CSPs’ ASICs; Progress to Depend on Supply Expansions and Preparation of GB Racks

Major CoWoS supplier TSMC continues to expand its capacity alongside the ongoing growth in demand for AI chips, such as GPUs and ASICs of CSPs. TSMC came to a total CoWoS capacity of...

29. Display Driver IC Supply Chain and Market Status_4Q24

A New Era of IC Packaging: The Crucial Role and Market Outlook of ABF

The report provides an in-depth exploration of the applications and growing demand for ABF substrates in AI servers, autonomous vehicles, and high-performance computing (HPC). Furthermore, it provides...

NVIDIA’s Blackwell Ultra to Rename to B300; Stronger Adoption for CoWoS-L GPUs Projected in 2025 to Actuate Expansions of HBM3e 12hi and Liquid-Cooling Solutions

TrendForce’s observations indicate that NVIDIA is currently the global leader of AI chip supplier, and comprises of almost 90% of the GPU AI server market in 2024...

NVIDIA’s Blackwell Ultra to Rename to B300; Stronger Adoption for CoWoS-L GPUs Projected in 2025 to Actuate Expansions of HBM3e 12hi and Liquid-Cooling Solutions

TrendForce forecasts that NVIDIA will focus on promoting its Blackwell B300 series AI chips in 2025, with increased adoption of CoWoS-L packaging and liquid cooling solutions. The B300 series will rep...

29. Display Driver IC Supply Chain and Market Status_3Q24

FOPLP to Accommodate Different Types of Suppliers with Market Segmentation

(a) incentives for chip makers to adopt FOPLP solution: AI GPU makers pursuing chip packaging size expansion could adopt chip-last solution, while power IC and RF IC makers pursuing packaging cost red...

Rise of AI Applications Has Triggered a Wave of Demand for CoWoS, Leading Taiwan-based Equipment Providers to Fully Commit to Developing Chip Packaging Solutions

According to research by the global market intelligence firm TrendForce, the global AI server market has been experiencing rapid growth over the years...

Analysis of the Development and Future Strategies of Japan’s Semiconductor Equipment and Materials Industry

Japan is comparatively advantageous in semiconductor equipment related to coating/lithography, cleaning, as well as wafer dicing and testing...

New Era for Japanese Semiconductor Industry: Innovations and Development Trends under Governmental Interventions

Japan is currently advantageous in semiconductor materials and equipment, and is incentivizing key wafer suppliers to establish local fabs in the country by offering political support, whilst developi...

AMD and NVIDIA Take the Lead in Transitioning to FOPLP for PC CPU, PMIC, and AI GPU to Reduce Cost and Expand Packaging Sizes of Large-Sized Chips

As indicated by the survey of global market intelligence firm TrendForce, chip suppliers such as AMD have been actively involved in negotiations with TSMC and OSAT throughout 2Q24...

AMD and NVIDIA Take the Lead in Transitioning to FOPLP for PC CPU, PMIC, and AI GPU to Reduce Cost and Expand Packaging Sizes of Large-Sized Chips

As indicated by the survey of global market intelligence firm TrendForce, chip suppliers such as AMD have been actively involved in negotiations with TSMC and OSAT throughout 2Q24 on chip packaging us...

29. Display Driver IC Supply Chain and Market Status_2Q24

From 2.5D to 3D: Key Processes of Hybrid Bonding and Strategies of Equipment Providers

Under the influence of growing AI-related demand and the slowing pace of node migration under Moore’s Law, achieving lower power consumption and higher transistor counts on a single chip has become a...