IC Testing & Packaging

NAND Flash Faces BT Substrate Shortage: 2H25 Supply Chain Pricing Outlook | TrendForce

NAND Flash Faces BT Substrate Shortage: 2H25 Supply Chain Pricing Outlook

Jun 25, 2025 | PDF

AI chip boom drives CoWoS expansion, straining raw material supply for ABF and BT substrates, delaying NAND Flash output.

Display Driver IC Supply Chain and Market Status - 2Q25 | TrendForce

Display Driver IC Supply Chain and Market Status - 2Q25

Jun 11, 2025 | ZIP

This report contains 2 major sections: industry's“dynamic issues”and “trends of costs & prices”. In the section of "industry's dynamic issues&amp...

NVIDIA’s GB200 Rack Shipments Will Increase After 2Q25; Computex Highlights Applications Related to AI Agents and Expanded Investments in Taiwan That Will Spur Long-Term Development of AI Server Supply Chai | TrendForce

NVIDIA’s GB200 Rack Shipments Will Increase After 2Q25; Computex Highlights Applications Related to AI Agents and Expanded Investments in Taiwan That Will Spur Long-Term Development of AI Server Supply Chai

May 21, 2025 | PDF

"TrendForce reports that NVIDIA announced plans at Computex 2025 to expand investments and strengthen AI server supply chain cooperation in Taiwan, including building AI supercomputers, expan...

NVIDIA’s GB200 Rack Shipments Will Increase After 2Q25; Computex Highlights Applications Related to AI Agents and Expanded Investments in Taiwan That Will Spur Long-Term Development of AI Server Supply Chain | TrendForce

NVIDIA’s GB200 Rack Shipments Will Increase After 2Q25; Computex Highlights Applications Related to AI Agents and Expanded Investments in Taiwan That Will Spur Long-Term Development of AI Server Supply Chain

May 21, 2025 | PDF

According to TrendForce’s latest supply chain survey, NVIDIA announced an ambitious series of plans at Computex 2025 to expand its investment and enhance supply chain cooperation in Taiwan...

Hybrid Bonding Technology Heralds a New Era in Advanced Semiconductor Packaging | TrendForce

Hybrid Bonding Technology Heralds a New Era in Advanced Semiconductor Packaging

May 21, 2025 | PDF

As indicated by the survey of global market intelligence firm TrendForce, for decades, Moore's Law has driven the exponential growth of the semiconductor industry...

Analysis of TSMC’s North America Technology Symposium: Unveiling of Roadmap for Advanced Packaging Solutions and Related Strategy | TrendForce

Analysis of TSMC’s North America Technology Symposium: Unveiling of Roadmap for Advanced Packaging Solutions and Related Strategy

May 07, 2025 | PDF

For decades, the semiconductor industry has thrived by adhering to Moore’ Law, achieving rapid development through the continuous miniaturization of transistors...

Top 10 Global OSAT Companies in 2024—Mature Leaders Stay Strong While New Regional Forces Emerge | TrendForce

Top 10 Global OSAT Companies in 2024—Mature Leaders Stay Strong While New Regional Forces Emerge

May 05, 2025 | PDF

"TrendForce's 2024 OSAT report highlights packaging's rising importance due to Moore's Law limits and chip complexity. Asian firms dominate, with Taiwan maintaining...

Top 10 Global OSAT Companies in 2024—Mature Leaders Stay Strong While New Regional Forces Emerge | TrendForce

Top 10 Global OSAT Companies in 2024—Mature Leaders Stay Strong While New Regional Forces Emerge

May 05, 2025 | PDF

According to the global market intelligence firm TrendForce, as the limitations of Moore’s Law become more apparent, IC packaging and testing have become critical for the continued...

Activation of Sovereign AI: Opportunities and Challenges on Chips and Advanced Packaging Technology | TrendForce

Activation of Sovereign AI: Opportunities and Challenges on Chips and Advanced Packaging Technology

Apr 17, 2025 | PDF

Geopolitical instability has fostered the rising consciousness of sovereign AI in 2025, thus prompting the US, Europe, China, and Japan to successively revitalize their domestic chip industries. These...

NVIDIA Announced Next-Gen B300, Rubin, and Vera at GTC 2025; Shift from GB NVL72 to VR NVL144 and Rubin Ultra NVL576 to Advance Memory, Liquid-Cooling, and CPO Communication Network | TrendForce

NVIDIA Announced Next-Gen B300, Rubin, and Vera at GTC 2025; Shift from GB NVL72 to VR NVL144 and Rubin Ultra NVL576 to Advance Memory, Liquid-Cooling, and CPO Communication Network

Mar 19, 2025 | PDF

As indicated by the survey of global market intelligence firm TrendForce, NVIDIA provided updates to several of its cloud...

CoWoS Production Capacity Will Continuously Adjust to Meet Actual Demand, and CSPs Keep Providing Strong Momentum for Orders Related to NVIDIA’s GPUs and In-House ASICs | TrendForce

CoWoS Production Capacity Will Continuously Adjust to Meet Actual Demand, and CSPs Keep Providing Strong Momentum for Orders Related to NVIDIA’s GPUs and In-House ASICs

Mar 14, 2025 | PDF

"TrendForce reports TSMC's recent CoWoS capacity adjustment is due to prior customer overbooking, but CSP demand remains largely unchanged. 2025 CoWoS total demand is...

CoWoS Production Capacity Will Continuously Adjust to Meet Actual Demand, and CSPs Keep Providing Strong Momentum for Orders Related to NVIDIA’s GPUs and In-House ASICs | TrendForce

CoWoS Production Capacity Will Continuously Adjust to Meet Actual Demand, and CSPs Keep Providing Strong Momentum for Orders Related to NVIDIA’s GPUs and In-House ASICs

Mar 14, 2025 | PDF

According to the latest supply chain survey by TrendForce, recent adjustments in TSMC’s CoWoS production capacity can be assessed from both supply and demand perspectives...

29. Display Driver IC Supply Chain and Market Status_1Q25 | TrendForce

29. Display Driver IC Supply Chain and Market Status_1Q25

Mar 11, 2025 | ZIP

NVIDIA Is Expected to Increase Shipments of Blackwell GPUs Featuring CoWoS-L, and US Trade Restrictions May Also Reduce Demand for CoWoS-S | TrendForce

NVIDIA Is Expected to Increase Shipments of Blackwell GPUs Featuring CoWoS-L, and US Trade Restrictions May Also Reduce Demand for CoWoS-S

Jan 15, 2025 | PDF

TrendForce indicates that NVIDIA will increase shipments of Blackwell GPUs featuring CoWoS-L in 2025, while US trade restrictions may reduce demand for CoWoS-S. NVIDIA's adjusted CoWoS order...

NVIDIA Is Expected to Increase Shipments of Blackwell GPUs Featuring CoWoS-L, and US Trade Restrictions May Also Reduce Demand for CoWoS-S | TrendForce

NVIDIA Is Expected to Increase Shipments of Blackwell GPUs Featuring CoWoS-L, and US Trade Restrictions May Also Reduce Demand for CoWoS-S

Jan 15, 2025 | PDF

According to the latest research by global market intelligence firm TrendForce, shipments of chips under NVIDIA’s new Blackwell platform, which is set to launch in 2025...

Get in touch with us


Get in touch with us