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NAND Flash Faces BT Substrate Shortage: 2H25 Supply Chain Pricing Outlook
Last Modified
2025-06-25
Update Frequency
Aperiodically
Format
AI chip boom drives CoWoS expansion, straining raw material supply for ABF and BT substrates, delaying NAND Flash output.
Key Highlights
- The AI chip surge drives rapid expansion of TSMC's CoWoS packaging capacity, boosting high-end ABF substrate demand.
- Both ABF and BT substrates rely on materials like low-CTE cloth, copper clad laminate, and prepreg, causing supply bottlenecks due to overlapping raw material usage.
- BT substrate delays impede the packaging schedule of SSD controllers and storage solutions in smartphones and automotive products, triggering a ripple effect along the NAND Flash supply chain.
- In the short term, vendors should secure inventory and diversify suppliers; mid-term strategies depend on the progress of raw material and substrate capacity expansions and upstream adjustments.
Table of Contents
- Expanded CoWoS Capacity Widens Material Gap; BT Substrate Shortages to Affect NAND Flash Supply Chain
- Schematics on Pressure of NAND Flash Controller Supply Chain Induced by Expanding CoWoS Capacity
- Short-term Stockpiling Strategy and Mid-term Focus on Capacity Expansion
- Forecast on Prices of NAND Flash Products for 2H25
<Total Pages: 5>
Category: NAND Flash
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