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NAND Flash Faces BT Substrate Shortage: 2H25 Supply Chain Pricing Outlook

Last Modified

2025-06-25

Update Frequency

Aperiodically

Format

PDF

Overview

AI chip boom drives CoWoS expansion, straining raw material supply for ABF and BT substrates, delaying NAND Flash output.

Key Highlights

The AI chip surge drives rapid expansion of TSMC's CoWoS packaging capacity, boosting high-end ABF substrate demand.
Both ABF and BT substrates rely on materials like low-CTE cloth, copper clad laminate, and prepreg, causing supply bottlenecks due to overlapping raw material usage.
BT substrate delays impede the packaging schedule of SSD controllers and storage solutions in smartphones and automotive products, triggering a ripple effect along the NAND Flash supply chain.
In the short term, vendors should secure inventory and diversify suppliers; mid-term strategies depend on the progress of raw material and substrate capacity expansions and upstream adjustments.

Table of Contents

Expanded CoWoS Capacity Widens Material Gap; BT Substrate Shortages to Affect NAND Flash Supply Chain
- Schematics on Pressure of NAND Flash Controller Supply Chain Induced by Expanding CoWoS Capacity
Short-term Stockpiling Strategy and Mid-term Focus on Capacity Expansion
- Forecast on Prices of NAND Flash Products for 2H25

<Total Pages: 5>

Forecast on Prices of NAND Flash Products for 2H25

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