2026 Outlook: NVIDIA Rubin Drives New Wave of AI Hardware Upgrades

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2026-03-18

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As data centers adopt HVDC architectures to reduce grid-to-chip power losses, demand for advanced power conversion and next-gen semiconductors surges. Meanwhile, Asian manufacturers continue to dominate the PCB and specialized substrate supply chains.

Key Highlights

PCB Supply: Asian firms lead from raw materials to advanced substrates.
Materials: Glass fibers are tailored for either signal transmission or stability.
Efficiency: High-voltage designs minimize massive power step-down losses.
Power Tech: Demand rises for advanced power conversion and backup systems.
Semiconductors: Next-gen, low-loss semiconductors highly benefit from this shift.

Rubin Generation Marks a Major Step Change, Reshaping the AI Hardware Stack
Surging Power Consumption in AI Servers Makes Liquid Cooling a Standard Configuration
Rising Rack Power Density Drives Power Architecture Upgrades
PCBs Undergo Major Design Transformation to Meet Signal Integrity and Space Constraints
Physical Limits of Coopper—Distance and Signal Loss—Accelerate the Shift to Optical Interconnects
TRI’s View

Four Key Upgrade Directions for AI Server Hardware