As Diverse Applications Drive Market Growth of HBM, 2.5D Packaging Plays a Critical Role in Development of This Memory Solution

Last Modified

2023-06-09

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Summary
The load of cloud computing will continue to elevate under the advancement of diversified applications, where restricted growth of performance in DDR SDRAM could encumber the performance of computing systems, which allows HBM to further exert its abilities. This report probes into the demand background and development tendencies of HBM, and focuses on the 2.5D packaging technology that integrates HBM.

Table of Contents
1. Successive Emergence of Four Major Applications Sustains Growth Momentum in Computing Demand

2. HBM Will Be the Best Solution for Building High-Performance Computing Platforms

3. 2.5D Packaging Technology Portrays an Essential Role amidst Expanding Incorporation of HBM

4. TRI’s View
   (1) Emergence of Supercomputer, AIGC, 8K, and AR/VR Applications to Drive Establishment of
   High-Performance of Computing Platforms
   (2) TSMC Possesses Most Competitive Advantages in 2.5D Packaging Technology Yielded by HBM

＜Total Pages：13＞

Category: Semiconductors

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