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Memory price surge continues into 1Q26, pushing BOM cost to a critical point. Brands freeze price cuts and downsize specifications, facing severe sales challenges.
The foundry sector is undergoing a broad realignment as mature nodes contract, product mixes shift upward, and Chinese demand supports steady growth. Advanced-node expansion continues to face technical constraints.
Benefiting from inventory stocking for smartphones and PCs alongside a recovery in automotive demand, the rebound in mature processes drove growth for UMC and HuaHong. TSMC's advanced processes and AI boosted Q3 production value, while Chinese foundry Nexchip climbed to eighth place, with a stable outlook for Q4.
Soaring memory prices increase system costs and retail prices, hurting the consumer market. TrendForce thus lowered 2026 shipment forecasts for smartphones, notebooks, and game consoles. Game console makers may abandon price cuts due to costs, shifting to high-price, profit-preserving strategies.
Global foundry markets show steady demand and diverse capacity as leaders push advanced processes and packaging amid geopolitics.
Advanced-process expansion and layouts for both Chinese foundries and GlobalFoundries, stressing supply autonomy and cross-border investment amid strategic shifts for long-term needs.
AI-driven demand push chiplet-based packaging; EMIB costs less than CoWoS, signaling a move to modular, efficient interconnects.
The latest Foundry Newsletter reports analyzes the global foundry market, noting demand-supply dynamics, yield issues across fabs, and shifting supply chains amid uncertainty.
Strong domestic demand in China is pushing 8-inch foundry utilization to full capacity, prompting price hikes and expansion plans. Clients are securing advanced node capacity through strategic partnerships, while geopolitics reshapes supply chains.
AI and smartphone demand lift 2H foundry utilization; Semiconductor tariffs pending and low inventory spur rush orders. China's mature nodes tighten, prices stabilize.
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