AI demand reshapes foundry priorities: photonics, packaging gains, tight mature nodes, rising power investment.
Major foundries push fab buildouts, transfer orders, price talks, and specialty processes to boost capacity.
AI-driven demand displaces mature node capacity, triggering price hikes across 8-inch and 12-inch foundry that could last through 2027.
AI-driven advanced packaging demand is reshaping the probe card market, boosting margins and triggering a major shift in global supplier rankings.
AI-driven HPC demand has elevated probe card technology, from MEMS upgrades to silicon interposers, while ATE leaders accelerate vertical integration.
Foundry pricing trends tighten across mature nodes in 2026, with AI demand driving advanced-process overflow orders and reshaping competitive dynamics.
Taiwan foundries including TSMC, UMC, Vanguard, and PSMC are raising prices amid tight capacity, with increases set to extend into 2027.
Taiwan foundries including TSMC, UMC, Vanguard, and PSMC are raising prices amid tight capacity, with increases set to extend into 2027.
Major foundries see rising utilization and pricing power, driven by front-loading demand and surging AI orders, lifting 2026 full-year outlook.
Taiwan foundries see strong 2Q26 rebound, led by TSMC's 3nm ramp and packaging, with peers eyeing HBM and interposer.
Research Areas:
Industry News
