TrendForce provides industry research reports on AI servers and data centers, covering GPU server shipments, CSP capex trends, and liquid cooling adoption.
Reports cover GPU and ASIC server shipment forecasts, hyperscaler capex, and data center build-out dynamics; in-depth tracking of HBM (HBM3e, HBM4) supply-demand balance, market pricing, and vendor competition; alongside analysis of liquid cooling penetration, co-packaged optics (CPO) mass production progress, server CPU demand shifts, and monthly Server DRAM and DIMM contract price updates.
Memory chip prices hitting record highs have damaged customer demand, causing contract price growth to narrow significantly. Suppliers aim to sustain high unit prices by diverting capacity to enterpri...
Robust CSP capex drives AI server growth, led by NVIDIA racks, as ASICs, China's supply chain, and liquid cooling advance.
Leveraging TrendForce’s extensive research on the AI supply chain, this report expands its focus to high-growth cloud service providers (CSPs). It offers comprehensive medium-to-long-term forecasts fo...
Server DRAM contract prices are trending upward. Supply shortages and HBM crowding effects strengthen vendor pricing power. High-capacity module premiums are narrowing due to stable yields and demand...
TrendForce: NVIDIA still weighs Rubin Ultra HBM options as tight DRAM supply pushes suppliers toward much higher prices.
Grid bottlenecks drive AI data centers to BTM power. Next-gen AI liquid cooling boosts thermal content per rack.
Green communications leverages nuclear power, liquid cooling, and virtual power plants to overcome energy barriers for 5G and AI, integrating green hydrogen and small reactors for low-carbon power whi...
Steady momentum in AI infrastructure builds is driving robust demand for cloud and server storage, supporting original suppliers in maintaining extremely low inventories and strong pricing leverage. C...
Driven by strong demand from cloud service providers, the demand for HBM and server modules has surged. However, constrained by long equipment lead times and capacity reallocation, supply growth conti...
Global Capex rises on AI buildout as China speeds self-reliant chips, easing foreign hardware reliance.
Global Server Market – Trends and Outlook for 3Q26
Global AI server momentum builds as CSPs expand rack buys, hyperscalers advance in-house chips, and OEM orders grow.
Driven by government policy, China’s humanoid robot industry is moving toward standardization and use-case segmentation, focusing on three major technological pillars: embodied AI, motion control, and...
JEDEC-defined SPHBM4 frees HBM from the interposer, trading latency and power for cost and layout.
As global computing power expands, traditional cabling faces severe thermal and power bottlenecks. Emerging Micro LED CPO technology, with its micron-level size and ultra-low power consumption, has be...
