TrendForce provides industry research reports on AI servers and data centers, covering GPU server shipments, CSP capex trends, and liquid cooling adoption.
Reports cover GPU and ASIC server shipment forecasts, hyperscaler capex, and data center build-out dynamics; in-depth tracking of HBM (HBM3e, HBM4) supply-demand balance, market pricing, and vendor competition; alongside analysis of liquid cooling penetration, co-packaged optics (CPO) mass production progress, server CPU demand shifts, and monthly Server DRAM and DIMM contract price updates.
Inference demand drives CSP ASIC growth past GPUs; Google's next TPU adopts EMIB-T, with substrate yield key to cost.
CSP and Neocloud demand lifts the AI server outlook as NVIDIA shifts to VR200, AMD and ASICs gain, and cooling upgrades.
Hyperscaler Capex keeps rising on price hikes and shortages; pricier AI racks drive server value growth over volume.
US hyperscalers keep expanding, but midterm-driven backlash may raise costs and delay permits for later-stage projects.
AI chip and server growth accelerates in 2027 on rack-scale systems and ASICs, while HBM and CoWoS supply stays tight.
TrendForce combines its expertise in the Foundry/Server industry and leverages it with the supply chain to accurately estimate AI chip shipments, AI Server application ratios, AI major suppliers&a...
TrendForce combines its expertise in memory market and leverage it to provide a multi-faceted study of server market in this report. The content of it is as follows: 1. Server CPU Market: State of Co...
Robust add-on demand from US cloud service providers is pushing up long-term agreement price bands and driving server memory contract prices steadily higher. Conversely, Chinese providers are pivoting...
Surging AI server demand drives power semiconductor and thermal upgrades, with tight supply boosting extended orders, price hikes, and capacity expansion.
This exhibition report focuses on two key components of near-eye displays—light engines and waveguides. By tracking the product development and capacity expansion of major suppliers, the report provid...
NVIDIA shipments stay Blackwell-led as Rubin's ramp slips into next year on HBM4 snags, keeping HBM the key bottleneck.
AI chip makers weigh downgrading HBM capacity, hitting capacity for KV cache, lifting offload memory demand, as 8hi stays mainstream.
AI server demand stays firm as CSPs order NVIDIA racks, Tier-2 centers gain share, and hyperscalers expand ASIC plans.
AI compute surges in 2026 as ASICs rise, NVIDIA defends its ecosystem, and bandwidth becomes the bottleneck.
This report uncovers the overall Micro LED market size and provides an in-depth analysis of distinct Micro LED applications and manufacturer dynamics, spanning various glass-based display applications...
