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HBM Market Bulletin - Jul. 17, 2026

Last Modified

2026-07-17

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Monthly

Format

PDF

JEDEC-defined SPHBM4 frees HBM from the interposer, trading latency and power for cost and layout.

Key Highlights

Origin: JESD330-4 defines SPHBM4 standard package.
Design Changes: Wider bump pitch, fewer I/O, higher pin speed.
Benefit: No interposer, lower system cost, more cooling flexibility.
Cost: SerDes adds latency, power consumption; may needs glass core substrate.
Status: Between HBM and MOP; timeline unclear.

Table of Contents

JEDEC Defines SPHBM4, Delivering HBM-Level Bandwidth via Standard Packaging
SPHBM4 Decouples HBM from Interposer
- Specification Comparison of HBM4 and SPHBM4
SPHBM4 Quadruples Host-to-Buffer Clock Frequencies, Using a 4:1 SerDes to Manage High-Speed Complexity
The Benefits and Trade-Offs of SPHBM4
SPHBM4 Sits Between HBM and MOP; Memory Suppliers Have Yet to Actively Invest

<Total Pages: 3>

Specification Comparison of HBM4 and SPHBM4

Category: AI/HBM/Server

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