Research Reports

HBM Market Bulletin - Jun. 23, 2026

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Last Modified

2026-06-23

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Update Frequency

Aperiodically

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Format

PDF



Diverging HBM4 certification timelines are reshaping 2026 market share, with Samsung gaining ground as SK hynix faces delays.

Key Highlights

  • Samsung Leads Certification: First to complete HBM4 validation and begin shipments in 2Q26; shipment volume revised upward, securing position on NVIDIA Rubin platform.
  • SK hynix Faces Delays: Interface sync issues push mass production to 3Q26; capacity redirected to DDR5/LPDDR5, with full-year HBM4 shipments revised down significantly.
  • Micron Largely Unaffected: Capacity remains concentrated on HBM3e; HBM4 shipments see only minor downward revision with limited market share impact.
  • Samsung Eyes 2027 Dominance: Targeting doubled HBM shipments year-over-year, capitalizing on the strategic window created by competitor delays.

Table of Contents

  1. Introduction
  2. Samsung's Annual HBM4 Shipments Are Expected to Be Revised Upward as the Supplier Becomes the First to Deliver This Product Generation
  3. SK hynix Encounters Qualification Delays; Its Full-Year HBM4 Shipments Are Revised Downward as Production Capacity Shifts to DDR5 and LPDDR5
  4. Micron Focuses Production Capacity on HBM3e; HBM4 Shipments See Only a Slight Downward Revision
  5. Samsung Is Expected to Significantly Expand HBM4 Market Share, and It Targets a Doubling of HBM Shipments for 2027
    • Distribution of HBM4 Shipments by Supplier

<Total Pages: 2>

Distribution of HBM4 Shipments by Supplier


Category: AI/HBM/Server




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