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AI Infra Market Bulletin – Jul. 30, 2026
Last Modified
2026-07-30
Update Frequency
Biweekly
Format
Grid bottlenecks drive AI data centers to BTM power. Next-gen AI liquid cooling boosts thermal content per rack.
Key Highlights
- Grid Bottlenecks: Delays make Behind-the-Meter (BTM) key for AI centers.
- Power Shift: Tech moves inside server rooms via SST, 800VDC, and VPD.
- Thermal Upgrades: Liquid cooling adoption boosts per-rack content value.
- Long Visibility: Power and cooling vendors hold multi-year order backlogs.
Table of Contents
- TrendForce’s View
- Power Industry Updates
- Estimated Regional Distribution of Deferred-Risk Capacity among North American CSPs to 2030
- Thermal Industry Updates
<Total Pages: 6>
Category: AI/HBM/Server
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