Subject


YMTC


2025-05-09

[News] China’s YMTC Dominates Hybrid Bonding Patents, Pressuring South Korean Memory Giants Samsung and SK hynix

As memory giants accelerate development in HBM4 and high-layer NAND, hybrid bonding technology is drawing heightened attention. South Korean leaders Samsung Electronics and SK hynix remain behind in key patents, according to a report from ZDNet. The report highlights that Samsung and SK hynix have d...

2025-04-29

[News] China’s NAND Giant YMTC Reportedly Lost Over $11M in First Nine Months of 2024 Amid Heavy Spending

YMTC, known for its hybrid bonding patent deal with Samsung and its push toward 294-layer NAND production, has quietly revealed mounting losses. Financial disclosures tied to an investment by Hebei Yangyuan Zhihui Beverage Co showed that YMTC posted an 84 million yuan (about US$11.6 million) loss in...

2025-03-14

[News] China’s YMTC Reportedly Joins NAND Price Hike, Set to Increase Over 10% in April

NAND prices are clearly on the rise, with U.S. and South Korean memory giants set to increase prices in April. Now, China’s largest NAND manufacturer YMTC may follow suit. According to Chinese media outlet MyDrivers, the company plans to raise NAND prices next month. The report indicates that Y...

2025-02-24

[News] Samsung Rumored to Adopt Hybrid Bonding Patent from China’s YMTC for 400+ Layer NAND

As memory giants fiercely compete to push the limits of NAND technology, a surprising twist has emerged: Samsung is reportedly set to use a hybrid bonding patent from China’s YMTC, starting with its V10 (10th generation) NAND, according to the latest ZDNet report. The report indicates that Sams...

2024-10-02

[News] XMC, Sister Company of YMTC, Has STAR Market IPO Application Accepted

On September 30, according to an announcement on the China Securities Regulatory Commission's website, Wuhan Xinxin Semiconductor Manufacturing Co. (XMC) has had its IPO application for the STAR Market officially accepted, marking the official start of its listing process. According to a report b...

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