The labor dispute sparked by TSMC’s venture into the United States is poised to come to a close. TSMC’s Arizona plant and the local labor union, Arizona Building and Construction Trades Council (AZBTC), announced an agreement yesterday. TSMC will collaborate with the local union to establish a workforce training program and maintain transparency on public safety issues.

However, TSMC also retains some flexibility, aiming to recruit local employees while seeking the option to hire foreign workers with “specialized experience” if deemed necessary.

It is anticipated that this agreement aligns with TSMC’s prior request for the dispatch of 500 professional equipment engineers from Taiwan to the United States. This move, with the successful acquisition of technical construction permits, is expected to facilitate the expedited installation of equipment, ensuring smooth operational processes in the future.

While TSMC’s move to set up a factory in the United States was fueled by favorable policies, it faced challenges as contractors were unfamiliar with U.S. regulations, causing delays in mechanical and electrical integration and cleanroom construction.

To expedite the installation of advanced process equipment for the groundbreaking four-nanometer fabrication process in the U.S., TSMC had to mobilize nearly 500 personnel from Taiwan for intensive installation work before system integration.

This decision sparked a strong backlash from the AZBTC, criticizing TSMC for disrespecting local technicians’ expertise and raising concerns about TSMC’s potential intention to introduce cheaper labor, impacting local job rights.

Although TSMC consistently emphasized maintaining good interactions with various unions in Arizona, some union representatives were displeased with TSMC’s practice of dispatching personnel through suppliers. Reportedly, they called on the state and federal governments to pressure TSMC, leading to unexpected delays in the installation of new equipment.

After months of negotiation between TSMC and AZBTC, an agreement was reached, listing agreed-upon priority areas, including union training, communication channels, and on-site personnel allocation. However, TSMC, considering global talent distribution, retained the flexibility to hire foreign construction personnel with specific expertise in certain circumstances.

According to the Greater Phoenix Economic Council(GPEC), the specific terms of the agreement reached between the two parties are as follows:

1. Enhanced Workforce Training and Development

A highly skilled, diverse, and inclusive construction workforce is necessary to meet the timelines of the two fabs. The AZBTC intends to recruit a sufficient number of skilled workers to fulfill manpower requirements of TSMC Arizona’s contractors for the Project. TSMC Arizona will partner with AZBTC on the development of union workforce training programs and curricula. The goal will be to build a construction workforce that can support TSMC Arizona in the near and long term with employment opportunities.。

2. Shared Commitment to Site Safety

TSMC Arizona is deeply committed to workplace safety in the operation of all its facilities. To enhance the partnership, TSMC Arizona will maintain transparency with AZBTC with regards to safety assessments, audits, incident records and improvement plans.

3. Industry Leading, Global Workforce

TSMC Arizona is focused on hiring workers locally in the United States. The AZBTC workforce is highly skilled in constructing microchip manufacturing plants. Circumstances may require TSMC Arizona or its vendors to employ foreign workers with specialized experience.

4. Open and Regular Communication

To ensure TSMC Arizona and AZBTC are fulfilling the spirit of the agreement outlined, and accountable to commitments made, ongoing communication and review via regular forums will be critical. A committee will be formed, consisting of members designated by the affiliated AZBTC unions and members designated by TSMC Arizona and the contractors. These meetings will be held quarterly, one of which will be an annual forecast meeting to project future workforce requirements.

The report notes that TSMC also mentioned in a joint statement that its construction of a fab in Arizona represents the largest single foreign direct investment in the state’s history. This wafer fab is set to be the most advanced semiconductor manufacturing base in the United States, creating thousands of stable and high-paying job opportunities locally.

The ongoing construction of the wafer fab’s two-phase project has already generated thousands of jobs in accordance with the prevailing industry wage standards for members of the AZBTC.

(Photo credit: TSMC)

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• [News] Apple Expands Amkor Partnership at Arizona Fab with Amkor’s $2B Investment in Advanced Packaging

On October 17, 2023, the U.S. government once again expanded its restrictions on the export of semiconductor devices and products to China. The newly added control conditions now encompass NVIDIA’s L40S, A100, H100H800, as well as general-purpose AI server GPUs tailored for the Chinese market, such as A800 and H800. Additionally, AMD’s MI200 series, MI300 series GPUs, and Intel’s Habana Labs’ Gaudi 2, Gaudi 3 GPUs fall under the regulatory framework.

Recalling the U.S. government’s export restrictions on AI chips issued to IC design firms in September 2022, at that time, only A100, H100, and MI200 series were subjected to control, and the U.S. Department of Commerce granted NVIDIA and AMD a one-year buffer period.

In contrast, the recent regulations not only cover all mainstream AI server GPUs but also eliminate the buffer period for these chip companies. In essence, companies or institutions in countries not permitted for export can only acquire AI server chips with performance potentially inferior to NVIDIA L40S or AMD MI200 series for the next few years.

Furthermore, stricter control thresholds for lithography equipment have led to the inclusion of ASML’s DUV, the 1980Di, in the control list. This equipment is primarily used in the 28 ~ 7nm process. Previously controlled products were focused on the EUV 3000 series for 7nm and below processes and the DUV 2000 series for 16/14 ~ 5nm processes.

This move indicates that the U.S. government’s desire to control semiconductor process technology has officially extended to mature processes of 28nm.

The expanded U.S. controls on AI chips and semiconductor manufacturing devices not only target China but also countries that might collaborate with Chinese institutions and businesses in AI development.

In this scenario, China is left with only two viable options to establish efficient AI computing resources: (1) designing and mass-producing AI server chips itself or (2) utilizing the computing resources of cloud service providers.

As the U.S. is also discussing the potential inclusion of cloud service providers in semiconductor control policies and currently formulating relevant countermeasures, this path remains unreliable for China. Therefore, the only dependable option is to independently design and manufacture AI server chips.

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On October 17, 2023, the U.S. government unveiled an updated set of regulations for semiconductor exports, introducing stricter standards for advanced AI chips. Additionally, these regulations expand control over the export of exposure equipment and include Chinese GPU design startups on an Entity List.

TrendForce’s Insights: 

1. New regulations cover chips, manufacturing equipment, and related companies, signaling an effort to restrain China’s AI development.

In this latest set of regulations, the U.S. has relaxed the I/O bandwidth restrictions for AI chips and introduced three additional conditions beyond a total processing performance (TPP) of ≥ 4800 TOPS:

(1) Total processing performance ≥ 1600 TOPS and performance density (PD) ≥ 5.92

(2) Total processing performance ≥ 2400 TOPS but < 4800 TOPS and performance density ≥ 1.6 but < 5.92

(3) Total processing performance ≥ 1600 TOPS and performance density ≥ 3.2 but < 5.92

As a result of these new conditions, NVIDIA’s A800, H800 GPU, and the recent launched L40S GPU for the Chinese market are now included in the list of controlled exports, similar to the A100 and H100 GPUs that were added in September 2022.

Concerning manufacturing equipment, the control threshold for exposure equipment has shifted from single-machine (specified substrate) coverage precision of ≤ 1.5nm to > 1.5nm but ≤ 2.4nm. This change directly led to the inclusion of ASML’s 1980Di DUV lithography machines.

On the corporate front, Chinese domestic GPU design startups such as Birentech, Moore Threads, and high-speed DSP design company Superfusion Semiconductor, along with their related entities, have been placed on the Entity List by the U.S. Department of Commerce.

In summary, these new regulations encompass chips, manufacturing equipment, and related companies. The U.S. is not only controlling the current mainstream AI product lines and applications of DUV lithography machines for 28-7nm processes but is also making a clear effort to interfere Chinese domestic manufacturers’ development of AI computation chips, indicating a strong determination to restrict China’s growth in the AI sector.

2. Priority for Chinese Enterprises: Securing AI Computing Resources through Cloud Service Providers

In light of the impact of the new U.S. semiconductor control regulations, Chinese domestic companies will be limited to AI chip performance not exceeding that of NVIDIA L40 GPU. As leading companies like NVIDIA, AMD, Intel, and others continuously boost the performance of their AI chips, the gap between the AI computing resources established by Chinese companies and their international counterparts will continue to widen.

Looking at it from an angle of independent research and development, with the inclusion of 1980Di and more advanced DUV lithography machines in the control list and the U.S. Department of Commerce placing Chinese IC design companies on the Entity List, short-term mass production of high-performance server AI chips in China seems unlikely.

Faced with challenges in both outsourcing and in-house production, the primary path for Chinese domestic companies to develop AI technology and applications is to obtain high-performance AI computing resources from international cloud service providers (CSP). It is worth noting that the U.S. government is also exploring limitations on Chinese firms attempting to evade semiconductor control policies through CSP. For Chinese companies, establishing robust customer relationships and building extensive AI computing resources are pressing priorities before related policies are enacted.
(Image: Pixabay)