Amid heightened attention on Intel’s EMIB (Embedded Multi-die Interconnect Bridge), TSMC is experiencing exceptionally strong demand for its own advanced packaging. According to Economic Daily News, a surge of AI and HPC orders from NVIDIA, Google, Amazon, and MediaTek has driven TSMC’s entire C...

TSMC has been actively expanding its advanced packaging capacity. According to MoneyDJ, the company held an opening ceremony for its AP7 facility in Chiayi, Taiwan, on the 4th. Supply chain sources note that Phase 2 of AP7 has recently begun equipment installation and testing, with production expect...

With AI compute demands soaring, silicon photonics is emerging as a next-generation technology poised to reshape the landscape. According to Hankyung, sources say that Samsung Electronics’ Device Solutions (DS) Division has designated the technology as a future strategic priority and begun recrui...

As memory makers push deeper into custom HBM logic dies for the HBM4 era, foundries—led by TSMC—are stepping up with more breakthroughs. German outlet HardwareLUXX reports that TSMC’s custom HBM4E, currently dubbed C-HBM4E, will leap to the N3P node. Along with dropping voltage from 0.8 V to 0...

On November 27, TrendForce successfully hosted the “2026 Top 10 Technology Market Trends & TechFuture Awards 2025,” on which it unveiled annual outlook for wafer foundry, memory, AI server, compound semiconductor, energy storage, AI robotics and other core technology sectors, providing forwa...