Though Intel plans to lower its 2025 capex to USD 20 billion from USD 24 billion in 2024, the semiconductor giant has been gearing up to receive its new high-NA EUV machine soon. According to a report from Dutch media outlet tweakers, the first modules of ASML’s TwinScan EXE:5200 will be delivered...

A couple of days ago, President Donald Trump has vowed to impose sector-specific tariffs on chips, oil, gas and more. With rising chip tariffs and production costs on the way, foundry giant TSMC is likely to raise prices for advanced nodes by over 15% in 2025, up from the previously expected 5% to 1...

Citing industry sources, Commercial Times reports that TSMC’s Arizona wafer fab, Fab 21 Phase 1, has officially entered mass production on its 4nm process in the first quarter of this year. Monthly capacity is expected to reach 30,000 wafers by mid-year. Meanwhile, construction for Fab 21’s P...

On January 16, Siliconware Precision Industries (SPIL), a subsidiary of ASE Technology Holding, officially inaugurated its new advanced packaging facility at the Tanzi Science Park. SPIL also announced that three additional advanced packaging facilities are set to expand production capacity by 2025....

Recently, leading foundries GlobalFoundries and TSMC have both ramped up efforts in advanced packaging, while the U.S. Department of Commerce has increased subsidies for advanced packaging technologies. GlobalFoundries Invests $575 million in Advanced Packaging and Photonics Center On January ...