[News] TSMC’s 2nm Wafers Rumored to Soar to $30K Per Unit, Yet CSP Giants Reportedly Rush to Adopt by 2027

As TSMC prepares for 2nm mass production in 2H25, wafer prices have reportedly hit $30,000 per unit for 2nm and could soar to $45,000 at future nodes, according to Commercial Times. Despite the steep cost, major CSPs are set to follow AMD, NVIDIA, and Broadcom in adopting the node in the next 2 years, the report adds.

Commercial Times, citing supply chain sources, suggests that developing a single 2nm chip—from project kickoff to final output—costs a staggering $725 million. Still, top players are diving in—AMD’s next-gen EPYC “Venice” was the first HPC chip taped out on TSMC’s N2 in April, with MediaTek set to follow in September (likely Dimensity 9600), as noted by the report.

Notably, Commercial Times indicates that Apple (A20, M6) and Qualcomm (Snapdragon 8 Elite Gen 3) are set to adopt TSMC’s 2nm for next year’s flagship chips—and cloud giants are close behind. Google’s Trillium TPU (v8), AWS’s Trainium 4, and Microsoft’s Maia 300 are all expected to follow before 2027, according to the report.

Among these, Microsoft’s Maia 300 is set to lead the pack, with a market debut expected in the second half of 2026, as per Commercial Times.

As noted by TrendForce, CSPs are prioritizing ASIC development to reduce reliance on NVIDIA and AMD, gain greater control over cost and performance, and bolster supply chain flexibility. Notably, TrendForce forecasts the strongest year-over-year growth in ASIC shipments among US CSPs for AWS in 2025.

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• [News] Intel Reportedly Joins AMD and Apple as TSMC’s First 2nm Clients, Tapping It for Nova Lake Production

(Photo credit: TSMC)