As semiconductor heavyweights spearheaded by TSMC accelerate panel-level fan-out packaging (FOPLP) development to revolutionize chip packaging efficiency, the technology is gaining significant traction. According to Commercial Times, supply chain sources reveal that FOPLP production equipment has be...

According to Liberty Times, TSMC Vice President of Advanced Packaging Technology and Service Jun He said demand for the company’s advanced packaging services is booming, with customers pressing closely. In response, TSMC is working to shorten timelines and accelerate capacity. He also stressed tha...

Apple, at the September 9 launch event, has unveiled its full iPhone 17 lineup, introducing the Air model for the first time. Powering these devices are the company’s latest in-house silicon, including new smartphone APs, modem and networking chips. Here’s a quick overview of the new chips revea...

As SEMICON Taiwan 2025 kicks off this week, the Silicon Photonics Global Summit took the spotlight on September 8, featuring senior executives from global chip giants such as TSMC, NVIDIA, and Broadcom sharing their latest progress. According to Commercial Times, K.C. Hsu, Vice President of Integrat...

Recent reports indicate that TSMC is spearheading an initiative with equipment makers and compound semiconductor partners to explore the use of 12-inch monocrystalline silicon carbide (SiC) for thermal substrates, aiming to replace conventional alumina, sapphire, or ceramic substrates. Traditiona...