With big techs led by NVIDIA betting on TSMC’s CoWoS, the foundry giant is moving ahead with its CoPoS (Chip-on-Panel-on-Substrate) technology amid strong AI demand. According to MoneyDJ and the Economic Daily News, TSMC’s first CoPoS pilot line is set for 2026, with mass production targeted by ...

TSMC is fast-tracking its U.S. expansion with a $100 billion investment covering three fabs, two advanced packaging plants, and an R&D center. However, supply chain insiders suggest the locations for the two U.S.-based packaging plants have yet to be decided, according to Liberty Times. TSMC ...

Recently, the global semiconductor giant TSMC announced a partnership with U.S. startup Avicena to jointly produce Micro LED-based optical interconnect products. The goal is to replace traditional electrical connections with advanced optical communication technologies, providing low-cost, high-effic...

TSMC is actively expanding its advanced packaging capacity. According to Economic Daily News, the company originally planned to move equipment into its AP7 advanced packaging facility in Chiayi, Taiwan during the third quarter, but suppliers have reportedly received updated notices pushing the timel...

TSMC Chairman C.C. Wei said at yesterday’s shareholder meeting that AI demand remains strong despite tariff concerns—and the momentum is clear. On June 3, major client Broadcom announced it has begun shipping its latest AI-focused networking chip, the Tomahawk 6, according to its press release. ...