According to Mydrivers, citing Not a Tesla App, Tesla is reportedly preparing to produce its next-generation FSD (Full-Self Driving) chip—internally referred to as AI5 or HW5—with TSMC as its foundry partner. Rumor has it that Tesla is planning to use TSMC's 3nm (N3P) process, as Notebookchec...

In the ongoing race within the semiconductor industry, TSMC and Samsung Electronics are fiercely competing to lead in 2nm chip manufacturing. As per recent reports, both companies plan to begin mass production of 2nm chips in 2H25. However, TSMC is at an advantage in securing orders due to its super...

According to Economic Daily News, fan-out panel-level packaging (FOPLP) is regarded as the next mainstream technology in advanced packaging. Key industry players—including foundry giant TSMC, semiconductor packaging and testing leader ASE, and memory packaging powerhouse Powertech—are actively i...

According to 9to5Mac, Apple is reportedly planning a MacBook Pro redesign in 2026, which would mark five years since the last major update. The following are some key features rumored to be part of the new design: OLED Display 9to5Mac notes that Apple is expected to bring OLED display technolo...

AMD officially unveiled its MI350 series GPUs at the Advancing AI 2025 event on June 12—and its key suppliers are now coming into focus. According to Commercial Times, both the MI350X and MI355X are built on TSMC’s N3P node. On the memory front, Sedaily reports that the chips pack 12-high HBM3E ...