Subject


TSMC


2023-07-06

ASE, Amkor, UMC and Samsung Getting a Slice of the CoWoS Market from AI Chips, Challenging TSMC

AI Chips and High-Performance Computing (HPC) have been continuously shaking up the entire supply chain, with CoWoS packaging technology being the latest area to experience the tremors. In the previous piece, "HBM and 2.5D Packaging: the Essential Backbone Behind AI Server," we discovered that th...

2023-06-30

Delay in Mass Production of Micro LED Apple Watch until 2026, According to Industry Sources

Apple has finally launched the Vision Pro, an MR device equipped with Micro OLED, but the debut of the Apple Watch with Micro LED panels has been repeatedly delayed. According to a report from TechNews, industry insiders revealed that the production timeline for the Micro LED Apple Watch has been pu...

2023-06-26

HBM and 2.5D Packaging: the Essential Backbone Behind AI Server

With the advancements in AIGC models such as ChatGPT and Midjourney, we are witnessing the rise of more super-sized language models, opening up new possibilities for High-Performance Computing (HPC) platforms. According to TrendForce, by 2025, the global demand for computational resources in the ...

2023-06-14

AI Servers: The Savior of the Supply Chain, Examining Key Industries

NVIDIA's robust financial report reveals the true impact of AI on the technology industry, particularly in the AI server supply chain. ......

2023-06-08

Decoding Apple’s Display Choice: Micro OLED Triumphs over Micro LED in Vision Pro

Apple's latest MR device, the "Vision Pro," utilizes Micro OLED technology. This technology, along with Micro LED, is considered the next generation of display technology. So what are the differences between Micro OLED and Micro LED, and which one is better suited for AR/VR/MR devices? According ...

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