A fire at Japanese industrial gas maker Kanto Denka Kogyo’s nitrogen trifluoride operations is raising alarms over semiconductor supply chain disruptions, as the company supplies major clients including TSMC, Samsung, Micron, and Japan’s Kioxia, Sony, and Rapidus—highlighting the potentially w...

According to TechNews, citing TechPowerUp and Wccftech, Apple’s next-generation M5 chips—set to be used in new MacBook Pro models launching in 2026—will reportedly feature a major upgrade in packaging technology, adopting LMC (Liquid Molding Compound) exclusively supplied by Taiwan’s Eternal...

According to ZDNet, Samsung Electronics is developing System-on-Panel (SoP), an advanced semiconductor packaging technology. The report notes that if SoP advances quickly, Samsung could secure a role in Tesla’s next-generation Dojo packaging supply chain. At present, Tesla plans to have its “AI6...

After announcing in early July plans to wind down its Gallium Nitride (GaN) wafer foundry services by July 31, 2027, TSMC has now confirmed—following yesterday’s board meeting—that it will also phase out 6-inch wafer production within two years and further consolidate 8-inch capacity to improv...

Just ahead of the reciprocal tariffs taking effect on August 7, U.S. President Trump announced plans to slap a 100% tariff on imported chips. According to Politico, the U.S. imported over $60 billion worth of chips in 2024, with Taiwan emerging as the top supplier at roughly $12 billion. As a result...