Subject


TSMC


2026-02-02

[News] GaN Industry Enters a New Phase as TSMC Licenses GaN Technologies to VIS and GF

Amid the surging global AI wave and the accelerating transition toward green energy, gallium nitride (GaN) industry is entering a pivotal golden growth period. According to TrendForce’s research, the global GaN power device market is projected to expand at a robust compound annual growth rate (CAG...

2026-01-30

[News] Meta’s MTIA-3 AI Chip Reportedly Tipped for 2H26 Debut, Built on TSMC 3nm with GUC Support

As Meta lifts its 2026 capital spending to US$115–135 billion—nearly double its 2025 outlay—CNBC reports that the company’s investment push remains in full swing. Commercial Times notes that Meta’s sustained capex momentum is directly driving stronger demand for AI servers and ASICs (appli...

2026-01-27

[News] Microsoft Unveils Maia 200 AI Chip on TSMC 3nm; SK hynix Reportedly Sole HBM3E Supplier

Microsoft unveiled its latest in-house AI chip, Maia 200, marking a further push into custom silicon for data-center AI workloads. According to the company’s press release, the chip is fabricated on TSMC’s 3nm process and features native FP8 and FP4 tensor cores designed to enhance performance a...

2026-01-21

[News] TSMC Advanced Packaging CapEx Projected to Grow 24% CAGR in 2025–27; AP7 Eyes WMCM, CoPoS

TSMC is scheduled to hold a media tour in Chiayi on the 22nd, marking the first time its Chiayi AP7 site will be opened to local media. According to Commercial Times, construction at TSMC’s Chiayi facilities is progressing at full speed. Supply-chain sources note that AP7 Plant 2 began equipment i...

2026-01-20

[News] TSMC Reportedly Expands WMCM Packaging for Apple, Capacity May More Than Double by 2027

TSMC has continued to ramp up investment in advanced packaging. According to Commercial Times, alongside its transition to a 2nm process for the A20-series chip used in the iPhone 18, Apple is set to upgrade packaging technology from the current InFO (Integrated Fan-Out) process to WMCM (Wafer-Level...

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