According to Central News Agency,  concerns have arisen that TSMC’s U.S. investment could crowd out its broader plans. Market rumors suggest the company is accelerating construction of its second and third Arizona fabs while halting the second phase of its advanced packaging plant in Chiayi, Taiw...

With TSMC’s 2nm process set for mass production in H2 2025, several major clients are already on board, and Taiwan’s MediaTek is the latest to join. The smartphone chipmaker announced today the successful tape-out of its first flagship SoC on TSMC’s 2nm process, with mass production scheduled ...

According to Commercial Times, sources say NVIDIA is weighing the adoption of TSMC’s most advanced process, the A16 — a 2nm-class node with backside power delivery slated for mass production in the second half of 2026. In 2026, alongside major smartphone makers adopting TSMC’s 2nm, AMD is set...

As semiconductor heavyweights spearheaded by TSMC accelerate panel-level fan-out packaging (FOPLP) development to revolutionize chip packaging efficiency, the technology is gaining significant traction. According to Commercial Times, supply chain sources reveal that FOPLP production equipment has be...

According to Liberty Times, TSMC Vice President of Advanced Packaging Technology and Service Jun He said demand for the company’s advanced packaging services is booming, with customers pressing closely. In response, TSMC is working to shorten timelines and accelerate capacity. He also stressed tha...