At Hot Chips 2025 (Aug. 24–26), Intel unveiled its next-generation Xeon processor, Clearwater Forest, which is built on 18A and scheduled for mass production in 2026, according to the Commercial Times. Notably, while Intel’s new E-core Xeon integrates 18A with Foveros Direct 3D advanced packa...

Amid scrutiny over Washington’s 10% stake in Intel, TSMC is pressing ahead with its U.S. expansion. MoneyDJ reports that site prep is underway for its two advanced packaging plants (AP1, AP2) in Arizona, with construction set to begin in 2H26 and production by 2028. The report also details TSMC...

According to South Korean media outlet Hankyung, citing sources, NVIDIA is working to reinforce its position in the HBM value chain by taking on the design of the “logic die,” a core component of HBM, starting in the second half of 2027, while also planning to diversify where it sources them. ...

According to Nikkei, citing sources, TSMC is removing Chinese chipmaking equipment from its leading-edge 2nm fabs to guard against potential U.S. restrictions that could disrupt production. As the report notes, sources said the decision was influenced by the prospect of a U.S. regulation that would ...

NVIDIA CEO Jensen Huang visited Taiwan again today (August 22), marking his third trip this year. According to Liberty Times, he said the visit was to prepare for the upcoming mass production of the Rubin platform, adding that he would personally meet with TSMC Chairman C.C. Wei to thank the company...