Subject


TSMC


2025-09-22

[News] Trump Proposes H-1B Visa Changes, Pressuring Indian Tech Workers; TSMC Reportedly Unaffected

According to Reuters, the Trump administration said on Friday it would require companies to pay $100,000 per year for H-1B worker visas, prompting some major tech firms to warn visa holders to remain in the U.S. or return quickly. As the report notes, the change could deliver a major blow to the tec...

2025-09-18

[News] TSMC Reportedly Denies Halting 2nd Phase of Chiayi, Taiwan Packaging Plant Amid U.S. Expansion

According to Central News Agency,  concerns have arisen that TSMC’s U.S. investment could crowd out its broader plans. Market rumors suggest the company is accelerating construction of its second and third Arizona fabs while halting the second phase of its advanced packaging plant in Chiayi, Taiw...

2025-09-16

[News] TSMC 2nm Gains Steam: MediaTek Completes First 2nm Tape-Out as Apple Preps A20, M6, R2

With TSMC’s 2nm process set for mass production in H2 2025, several major clients are already on board, and Taiwan’s MediaTek is the latest to join. The smartphone chipmaker announced today the successful tape-out of its first flagship SoC on TSMC’s 2nm process, with mass production scheduled ...

2025-09-15

[News] NVIDIA May Be Among the First to Adopt TSMC A16 for 2028 Feynman Architecture

According to Commercial Times, sources say NVIDIA is weighing the adoption of TSMC’s most advanced process, the A16 — a 2nm-class node with backside power delivery slated for mass production in the second half of 2026. In 2026, alongside major smartphone makers adopting TSMC’s 2nm, AMD is set...

2025-09-12

[News] FOPLP Trial Yields Reportedly Reach 90% at Powertech as TSMC Advances CoPoS Development

As semiconductor heavyweights spearheaded by TSMC accelerate panel-level fan-out packaging (FOPLP) development to revolutionize chip packaging efficiency, the technology is gaining significant traction. According to Commercial Times, supply chain sources reveal that FOPLP production equipment has be...

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