In late December 2023, reports surfaced indicating OpenAI CEO Sam Altman's intention to raise funds to construct a semiconductor plant, ensuring a secure supply of AI chips. According to a report from the Washington Post on January 24, 2024, Sam Altman has engaged with US congressional members to...

In a bid to enhance its foundry capabilities, Samsung is earnestly integrating hybrid bonding technology. According to industry sources, Applied Materials and Besi Semiconductor are establishing equipment for hybrid bonding at the Cheonan Campus, slated for use in next-generation packaging solutions...

The competition for dominance in 2nm semiconductor technology has intensified at the beginning of 2024, marking a crucial battleground among global foundry companies. As per a report from IJIWEI, major foundry enterprises such as Samsung Electronics, TSMC, and Intel are set to commence mass produ...

NVIDIA's AI chip supply faces constraints, with insufficient CoWoS advanced packaging production capacity at TSMC potentially being the main issue. According to Economic Daily News, NVIDIA is also providing advanced packaging services to Intel, with a monthly capacity of about 5,000 units. It is exp...

With the highly anticipated opening of TSMC's Kumamoto fab on February 24th, 2024, multiple Japanese or global semiconductor manufacturers are set to begin large-scale production in newly established plants in Japan. According to sources cited by TechNews, this development will stimulate the gro...