Following its March rollout of 12-layer HBM4 samples, SK hynix unveiled a long-term DRAM roadmap and sustainability vision at the 2025 IEEE VLSI Symposium in Kyoto (June 8–12), highlighting plans for sub-10nm technologies, according to its press release and ZDNet. Notably, in his keynote on Jun...

As memory giants reportedly brace for price hikes on DDR4 and DDR5, NAND suppliers are also seeing stronger-than-expected momentum in Q2. According to Commercial Times, the top five NAND Flash makers have cut production, fueling an upswing in memory pricing. The report suggests that major NAND ma...

As memory giants accelerate development in HBM4 and high-layer NAND, hybrid bonding technology is drawing heightened attention. South Korean leaders Samsung Electronics and SK hynix remain behind in key patents, according to a report from ZDNet. The report highlights that Samsung and SK hynix have d...

With Micron, SanDisk, and Samsung already raising prices, SK hynix is now the latest memory giant to jump on the bandwagon. According to China’s Wallstreetcn, citing supply chain sources, SK hynix has increased its consumer DRAM chip/die prices by 12%. According to No Cut News, SK hynix said at...

Amid growing tensions with its longtime TC bonder supplier Hanmi Semiconductor, SK hynix is reportedly taking things a step further. According to Financial News, the HBM leader has started reviewing a full diversification of all Hanmi-supplied equipment—not just TC bonders. While rumors suggest...