Amid growing tensions with its longtime TC bonder supplier Hanmi Semiconductor, SK hynix is reportedly taking things a step further. According to Financial News, the HBM leader has started reviewing a full diversification of all Hanmi-supplied equipment—not just TC bonders. While rumors suggest...

As memory giants gear up for the next-gen HBM battle, JEDEC has officially released the JESD270-4 HBM4 standard in mid-April. With AI models and HPC workloads demanding faster, larger memory, HBM4 is arriving just right on time. As per JEDEC’s press release, one of the major improvements in HBM...

SK hynix saw its Q1 operating profit surging 158% year-over-year, fueled by booming AI chip sales and stockpiling ahead of potential U.S. tariffs, as per Reuters. Despite the upbeat results, the South Korean memory giant warns that elevated macro uncertainties like tariff policy could lead to demand...

As the HBM race heats up among memory giants, TC (thermal compression) bonders are taking center stage. Notably, recent developments involving key player Hanmi Semiconductor, Micron, and SK hynix have sparked attention—and could potentially reshape the memory landscape, according to reports from T...

As the U.S. gears up to announce new tariffs on semiconductor products, anxiety is mounting among South Korean memory firms like Samsung and SK hynix. According to Sisa Journal and Asia Business Daily, both manufacture key memory semiconductors—including NAND and DRAM—in China, with their NAND p...