As SK hynix pushes ahead with HBM4 production, attention is turning to TC bonder suppliers. According to The Elec, citing sources, SK hynix has placed a new order for thermal compression (TC) bonders with Singapore-based ASMPT to support HBM4 manufacturing. The order reportedly comes amid an ongoing...

2027 is shaping up to be a pivotal year for SK hynix's next-generation NAND ambitions. The company is accelerating its next-generation AI NAND development by teaming up with NVIDIA, aiming to deliver storage performance up to 30 times faster than current enterprise SSDs by 2027, according to ZDNet. ...

SK hynix is pushing its NAND technology forward with the adoption of hybrid bonding. According to Hankyung, the company is developing 300-layer NAND that incorporates this process, joining other leading manufacturers—Samsung Electronics, China’s YMTC, and Japan’s Kioxia—in moving toward full...

As 2025 draws to a close, tech giants are rapidly reshuffling their organizations. After Samsung reinstated its dual-CEO structure and elevated Roh Tae-moon, SK hynix followed on the 4th with a major move of its own—launching a dedicated HBM taskforce to accelerate its AI-memory push, according to...

Google’s TPU is gaining traction as a strong alternative to NVIDIA, and Samsung is emerging as a beneficiary of the growing ASIC trend. According to Chosun Biz, Samsung Electronics is supplying HBM to Broadcom, the world’s largest ASIC design company, and its sixth-generation HBM (HBM4) has repo...