As SK hynix ramps up ties with major tech players like NVIDIA, advancing U.S. production through its Indiana advanced packaging plant is just one part of its strategy. According to the Puget Sound Business Journal via The Guru, the memory giant has now secured a new office in Seattle’s Bellevue ar...

As the HBM4 race accelerates, attention is turning to which supplier will secure the largest share of NVIDIA’s next-generation Rubin AI accelerator. According to SeDaily, both Samsung Electronics and SK hynix have begun delivering paid final HBM4 samples to NVIDIA—moving beyond free prototypes a...

As SK hynix pushes ahead with HBM4 production, attention is turning to TC bonder suppliers. According to The Elec, citing sources, SK hynix has placed a new order for thermal compression (TC) bonders with Singapore-based ASMPT to support HBM4 manufacturing. The order reportedly comes amid an ongoing...

2027 is shaping up to be a pivotal year for SK hynix's next-generation NAND ambitions. The company is accelerating its next-generation AI NAND development by teaming up with NVIDIA, aiming to deliver storage performance up to 30 times faster than current enterprise SSDs by 2027, according to ZDNet. ...

SK hynix is pushing its NAND technology forward with the adoption of hybrid bonding. According to Hankyung, the company is developing 300-layer NAND that incorporates this process, joining other leading manufacturers—Samsung Electronics, China’s YMTC, and Japan’s Kioxia—in moving toward full...