Subject


SiC


2025-09-24

[News] Huawei Released SiC Thermal Management Technology Patents

Huawei has recently disclosed two patents related to silicon carbide (SiC) thermal management technologies: “Thermal Conductive Composition and Its Preparation Method and Application” and “A Thermal Conductive and Wave-Absorbing Composition and Its Application.” The first patent outlines ...

2025-09-18

[News] South Korea Launches First 8-Inch SiC Plant in Busan, Annual Output Projected at 30K Wafers

With silicon carbide (SiC) offering superior heat resistance, voltage tolerance, and power efficiency over traditional silicon, global leaders like Infineon and Wolfspeed are racing ahead. Now, South Korea is stepping up too—Maeil Business Newspaper reports that Busan has opened the nation’s fir...

2025-09-16

[News] Silicon Carbide Battle Rekindled by Industry Giants: Wolfspeed, Samsung Make Waves

Despite intensifying competition from Chinese rivals, global chipmakers continue to accelerate their SiC investments amid the AI boom. According to Wealth Magazine, NVIDIA is reportedly planning to replace traditional silicon interposers with silicon carbide in its next-generation Rubin architecture...

2025-09-11

[News] South Korea to Double SiC Self-Sufficiency to 20% by 2030 Amid Chip Independence Push

According to Newsis, the South Korean government said it will double the nation’s technology self-sufficiency rate in silicon carbide (SiC) power semiconductors, raising it from the current 10% to 20% in 2030. The report points out that SiC power semiconductors are gaining traction in sectors s...

2025-09-09

[News] TSMC Eyes Breakthroughs in SiC Thermal Management

Recent reports indicate that TSMC is spearheading an initiative with equipment makers and compound semiconductor partners to explore the use of 12-inch monocrystalline silicon carbide (SiC) for thermal substrates, aiming to replace conventional alumina, sapphire, or ceramic substrates. Traditiona...

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