While SanDisk is speeding up the development of High Bandwidth Flash (HBF), a next-generation architecture that vertically stacks NAND, the company is also advancing additional memory concepts aimed at addressing structural capacity constraints. According to a U.S. patent (US 12,430,274 B2) filed...

As South Korea’s memory giants shift focus toward 1c DRAM capacity expansion amid surging demand, Global Economic, citing German tech outlet ComputerBase, reports that the Kioxia–SanDisk alliance is moving fast to reassert its position in the NAND market, capitalizing on an investment gap as Sam...

Long-term agreements are no longer confined to upstream memory suppliers such as Samsung Electronics and SK hynix. At its latest earnings call, SanDisk outlined a clearer picture of its New Business Model (NBM) with customers. According to the transcript from Investing.com, the company has already s...

As memory makers accelerate migration toward ~300-layer class NAND, Kioxia and SanDisk are reportedly pushing further ahead. According to EE Times Japan, the companies have achieved a world-first demonstration of quad-level cell (QLC) operation using a multi-stacked cell array CMOS (MSA-CBA) archite...

SanDisk is reportedly moving to establish a supply chain for HBF, a next-generation memory that stacks NAND. According to ETNews, sources say the company has begun engaging materials, components, and equipment partners to build out an ecosystem for an HBF prototype production line. It aims to introd...