According to a report from TechNews, South Korean memory giant SK Hynix is participating in COMPUTEX 2024 for the first time, showcasing the latest HBM3e memory and MR-MUF technology (Mass Re-flow Molded Underfill), and revealing that hybrid bonding will play a crucial role in chip stacking. MR-M...

Samsung has been strengthening its alliance regarding the semiconductor packaging technology, attempting to narrow the technological gap with TSMC, according to the latest report by Business Korea. Citing industry sources, Business Korea noted that Samsung is expected to expand its 2.5D and 3D MD...

Qualcomm President & CEO Cristiano Amon, at COMPUTEX 2024, showcased devices powered by Snapdragon X Elite and Snapdragon X Plus processors, claiming them to be the only PCs capable of delivering Copilot+ PC experiences. Afterwards, during a media briefing, he disclosed Qualcomm’s plans on a d...

JEDEC (the Solid State Technology Association) recently confirmed that the long-used SO-DIMM and DIMM memory standards will be replaced by CAMM2 for DDR6 (LPDDR6 included). According to a report from WeChat account DRAMeXchange, the minimum frequency for DDR6 memory is 8800MHz, which can be incre...

NVIDIA CEO Jensen Huang revealed that Samsung's High Bandwidth Memory (HBM) is still striving on the certification process, but is one step away from beginning supply. According to a report from Bloomberg on June 4th, Huang, during a briefing at the COMPUTEX, told reporters that NVIDIA is evaluat...