With numerous cloud computing companies and large-scale AI model manufacturers investing heavily in AI computing infrastructure, the demand for AI processors is rapidly increasing. As per a report from IJIWEI, the demand for HBM (High Bandwidth Memory), a key component among them, has been on the ri...

Samsung, as per a report from the global media outlet wccftech, has decided to enter the next generation of packaging technology by commencing R&D works for the adoption of "Glass Substrate" by 2026. The report further indicates that Samsung's preparation to enter the glass substrate indus...

There are market rumors suggesting that Samsung Electronics plans to switch to the chip manufacturing technology used by SK Hynix in an effort to catch up with competitors in the increasingly heated competition of high-bandwidth memory (HBM). As per Reuters’ report on March 13th, demand for HBM...

Amidst the AI frenzy, HBM has become a focal point for major semiconductor manufacturers, and another storage giant is making new moves. According to Korean media "THE ELEC", Samsung Electronics plans to establish an HBM development office to enhance its competitiveness in the HBM market. The si...

Recently, IC design company Marvell announced an expansion of its long-term partnership with TSMC to include 2-nanometer technology. They will collaborate on developing the industry's first 2-nanometer semiconductor production platform optimized for accelerating infrastructure. Currently, the...