Amid the overwhelming wave of Artificial Intelligence, the importance of advanced process chips is becoming increasingly prominent. Currently, the 3nm process is the most advanced node in the industry. Meanwhile, manufacturers such as TSMC, Samsung, Intel, and Rapidus are actively promoting the cons...

Samsung Electronics Co. has recently established a HBM team within its memory division, with the goal of enhancing yield during the development of the sixth-generation AI memory HBM4 and the AI accelerator Mach-1. According to a report of the Korea Economic Daily (KED) citing industry sources ...

Recently, South Korean media Alphabiz reported that Samsung may exclusively supply 12-layer HBM3e to NVIDIA. The report indicates NVIDIA is set to commence large-scale purchases of Samsung Electronics' 12-layer HBM3e as early as September, who will exclusively provide the 12-layer HBM3e to NVIDIA...

Amid the AI boom driving a surge in demand for advanced packaging, South Korean semiconductor giant Samsung Electronics is aggressively entering the advanced packaging arena. On the 20th, it announced its ambitions to achieve record-high revenue in advanced packaging this year, aiming to surpass the...

According to sources cited by Reuters,  TSMC is reportedly considering plans to establish a production line for its CoWoS technology in Japan. However, TSMC has yet to make any further decisions, and they have declined to comment on the matter. CoWoS is an advanced packaging technology that stac...