Recently, Guotou Jixin (Beijing) Equity Investment Fund (Limited Partnership) (“Guotou Jixin”), an investment vehicle under the Phase III China Integrated Circuit Industry Investment Fund Co., Ltd. (the “Big Fund Phase III”), has taken an equity stake in IC substrate maker AKM Meadville (Xia...

Raw material prices are climbing, and the semiconductor substrate industry is feeling the strain as the cost of critical inputs continues to rise. According to ZDNet, South Korea’s substrate makers are facing mounting pressure from sharp increases in raw material prices. Citing industry sources, t...

Fueled by booming demand for advanced packaging like CoWoS, a new report from China’s Wallstreetcn is turning heads with claims of a breakthrough “CoWoP” (Chip on Wafer on PCB) tech—mounting chips directly onto PCB mainboards via mSAP processes, skipping IC substrates entirely. However, Info...

The U.S. Department of Commerce has initiated the "National Advanced Packaging Manufacturing Program (NAPMP) ," with materials and substrates being the first subsidized areas. Due to the close collaboration between IC testing and IC substrates, it is not ruled out that the IC substrate industry coul...

GIGABYTE held an online earning call on November 1st, during which General Manager Etay Lee expressed optimism about the company's performance. The growth momentum in server and motherboard sectors remains robust, allowing GIGABYTE to potentially reach the significant milestone of NT$100 billion in ...