Amidst geopolitical influences, governments worldwide are enticing semiconductor manufacturers with subsidy policies, prompting chip manufactures to establish themselves in various regions. The ongoing dynamics of semiconductor facility construction and the evolving global production capacity remain focal points for the industry in 2024.

Following TSMC’s establishment of facilities in Arizona, USA, and Kumamoto, Japan, the progress of TSMC’s second Kumamoto plant has garnered significant industry attention. On another front, the developments at TSMC’s ESMC facility in Germany continue to capture global attention within the semiconductor industry.

Powerchip Semiconductor Corporation (PSMC) also made headlines in 2023 by announcing the construction of its first overseas 12-inch fab, JSMC, located in Sendai City, Miyagi Prefecture, Japan.

Meanwhile, Samsung’s overseas expansion efforts are equally robust. In addition to its Taylor plant in the United States, Samsung plans to establish a new semiconductor packaging research center in Japan.

According to TrendForce data, considering an equivalent foundry capacity of 12 inches, Taiwan held a global market share of approximately 47% in 2023, followed by China at 26%, South Korea at 12%, the United States at 6%, Singapore at 4%, Japan at 2%, Germany at 1%, and others at 2%. By 2027, Taiwan’s market share is projected to decrease to 42%, with China at 28%, South Korea at 10%, the United States at 7%, Singapore at 6%, Japan at 3%, Germany at 2%, and others at 1%.

(Image: TSMC)

Powerchip Semiconductor Manufacturing (PSMC), SBI Holdings, Inc., Japan’s Miyagi Prefecture and JSMC signed the Memorandum of Understanding on the 31st, confirming that JSMC’s first fab will be selected in Japan. The Second Northern Sendai Central Industrial Park in Ohira Village, Kurokawa District, Miyagi Prefecture (Second Northern Sendai Central Industrial Park) is the planned site.

It is understood that in August this year, PSMC and SBI jointly established JSMC and began preparations for setting up a wafer fab in Japan. After extensive discussions with the municipal government of the candidate locations and multiple on-site inspections, a number of factors were taken into consideration, including: the robustness of infrastructure such as water supply, drainage, high-voltage power supply, and logistics capabilities, as well as the park’s ability to withstand natural disasters, and surrounding life.

PSMC states that the quality of the environment and the potential for future industry-university cooperation ultimately led to the selection of the Second Northern Sendai Central Industrial Park as the site.

PSMC said that SBI is committed to working closely with the Japanese government, Miyagi Prefecture, partners and relevant financial institutions to discuss various details of investment in Japan. More information will be announced after the details are finalized.

(Image: PSMC)