China’s drive for semiconductor self-reliance is advancing, with fresh momentum in advanced packaging. According to South China Morning Post, SJ Semiconductor, a key player in China’s advanced chip packaging sector, has secured approval to list on Shanghai’s STAR Market. The report notes that ...

On January 21, JCET announced a major breakthrough in its co-packaged optics (Co-Packaged Optics, CPO) technology development. Silicon photonics engine products based on its XDFOI® multidimensional heterogeneous advanced packaging platform have completed customer sample deliveries and successful...

China’s packaging and testing industry is stepping up, with a surge in domestic investment fueling growth. According to ijiwei, from late 2025 to early 2026, leading A‑share OSAT companies have been particularly active, signaling a shift toward higher-end and more specialized capital spending. ...

According to Shanghai Securities News, China’s chip industry is reportedly seeing growth driven by AI. The report notes that among 102 A-share listed companies engaged in digital chip design, analog chip design, integrated circuit manufacturing, and IC packaging and testing, 66 posted profits in t...

On January 16, Siliconware Precision Industries (SPIL), a subsidiary of ASE Technology Holding, officially inaugurated its new advanced packaging facility at the Tanzi Science Park. SPIL also announced that three additional advanced packaging facilities are set to expand production capacity by 2025....