As memory giants accelerate development in HBM4 and high-layer NAND, hybrid bonding technology is drawing heightened attention. South Korean leaders Samsung Electronics and SK hynix remain behind in key patents, according to a report from ZDNet. The report highlights that Samsung and SK hynix have d...

Amid growing tensions with its longtime TC bonder supplier Hanmi Semiconductor, SK hynix is reportedly taking things a step further. According to Financial News, the HBM leader has started reviewing a full diversification of all Hanmi-supplied equipment—not just TC bonders. While rumors suggest...

United Microelectronics Corporation (UMC) is making significant strides in the advanced packaging sector, breaking new ground in a market traditionally dominated by TSMC. According to a report by Economic Daily News, UMC has secured a major advanced packaging order from Qualcomm for high-performance...

Global semiconductor giants are concentrating their R&D efforts on advanced packaging technologies to drive performance enhancements. According to a report from Commercial Times, as packaging technology progresses from 2.5D to 3D, chip stacking technologies have become a showcase for the competi...

According to the latest report by TheElec, though Samsung has been using thermal compression (TC) bonding until its 12-stack HBM, the company now confirms its belief that hybrid bonding is necessary for manufacturing 16-stack HBM. Regarding its future HBM roadmap, Samsung reportedly plans to prod...