BESI, an industry leader in hybrid bonding technology critical to HBM packaging, is reportedly attracting takeover interest. According to Reuters, sources say BE Semiconductor (BESI) has received takeover approaches as demand for its chip-packaging technology has become increasingly important for se...

Major semiconductor companies are reportedly considering easing thickness standards for next-generation HBM, as future generations such as HBM4E and HBM5 are expected to adopt 20-layer stacking. According to ZDNet, while the current HBM4 thickness standard is 775 micrometers (μm), industry discussi...

SK hynix is expected to continue using its MR-MUF process for HBM4 16-high products. According to DealSite, the company evaluated adopting fluxless bonding for HBM4 16-high but ultimately opted to retain its existing advanced MR-MUF process, concluding that the technology remains premature given per...

SK hynix is pushing its NAND technology forward with the adoption of hybrid bonding. According to Hankyung, the company is developing 300-layer NAND that incorporates this process, joining other leading manufacturers—Samsung Electronics, China’s YMTC, and Japan’s Kioxia—in moving toward full...

South Korean leaders Samsung and SK hynix dominate the HBM space, but there is one area where their position appears less secure. According to The Elec, a new analysis from the Korea Institute of Intellectual Property Promotion (KIPRO) finds that most key patents for HBM-related advanced packaging ...