As HBM suppliers weigh the shift to hybrid bonding for their 16-layer HBM4 products to address TSV yield bottlenecks, News1 Korea, citing industry analysts, reports that the hybrid bonding market is set to soar in the HBM4E era, with its share projected to hit around 50% by 2028. News1 Korea note...

According to a ZDNet report citing industry sources on the 25th, leading global semiconductor back-end equipment manufacturers are expected to expand their HBM hybrid bonding operations in the second half of 2025. BESI Expects Rising Hybrid Bonding Orders in H2 2025 On July 24, Dutch equipment...

According to a report from ZDNet on July 15, Hanmi Semiconductor Chairman Kwak Dong-shin dismisses speculation that the company will adopt a hybrid bonder system for now, stating that Hanmi’s TC bonders are sufficient for HBM4 and HBM5, following JEDEC’s April decision to relax AI packaging thic...

As Samsung and SK hynix charge ahead in the HBM race, an unexpected player is said to be entering the arena from a different angle. LG Electronics is reportedly making a bold push into the semiconductor equipment space by developing hybrid bonders for HBM, according to Sedaily. Sedaily suggests a...

As memory giants accelerate development in HBM4 and high-layer NAND, hybrid bonding technology is drawing heightened attention. South Korean leaders Samsung Electronics and SK hynix remain behind in key patents, according to a report from ZDNet. The report highlights that Samsung and SK hynix have d...