Please note that this article cites information from Chosun Ilbo, Newsis, News Tomato, and The Elec. JEDEC is reportedly considering relaxing standards governing next-generation HBM. According to Chosun Ilbo, sources indicate that JEDEC (Joint Electron Device Engineering Council) is weighing a ...

Please note that this article cites information from STAR Market Daily, Reuters, and The Asia Business Daily. SEMICON China 2026, the largest semiconductor industry event in Shanghai, opened on March 25. According to STAR Market Daily, several Chinese chip equipment makers showcased their latest...

Please note that this article cites information from The Elec. Rumors have recently resurfaced that lithography leader ASML is evaluating entry into the back-end semiconductor equipment market, targeting the fast-growing advanced packaging segment. According to Korean media outlet The Elec, ASML ha...

BESI, an industry leader in hybrid bonding technology critical to HBM packaging, is reportedly attracting takeover interest. According to Reuters, sources say BE Semiconductor (BESI) has received takeover approaches as demand for its chip-packaging technology has become increasingly important for se...

Major semiconductor companies are reportedly considering easing thickness standards for next-generation HBM, as future generations such as HBM4E and HBM5 are expected to adopt 20-layer stacking. According to ZDNet, while the current HBM4 thickness standard is 775 micrometers (μm), industry discussi...