Laser annealing adoption appears to be broadening. According to ETNews, the thermal treatment process is expanding beyond its traditional use in silicon (Si) wafers to silicon carbide (SiC), a material widely regarded as a leading candidate for next-generation power semiconductors. The report adds t...

SK hynix’s yields for hybrid bonding HBM have reportedly improved, although the company did not disclose specific figures. According to The Elec, Kim Jong-hoon, Technical Leader at SK hynix, said validation of its 12-high HBM using hybrid bonding has been completed, adding that the company is now ...

Please note that this article cites information from Chosun Ilbo, Newsis, News Tomato, and The Elec. JEDEC is reportedly considering relaxing standards governing next-generation HBM. According to Chosun Ilbo, sources indicate that JEDEC (Joint Electron Device Engineering Council) is weighing a ...

Please note that this article cites information from STAR Market Daily, Reuters, and The Asia Business Daily. SEMICON China 2026, the largest semiconductor industry event in Shanghai, opened on March 25. According to STAR Market Daily, several Chinese chip equipment makers showcased their latest...

Please note that this article cites information from The Elec. Rumors have recently resurfaced that lithography leader ASML is evaluating entry into the back-end semiconductor equipment market, targeting the fast-growing advanced packaging segment. According to Korean media outlet The Elec, ASML ha...