According to South Korean media outlet The Bell, Samsung Electronics and SK hynix are reportedly delaying the adoption of ASML’s high-NA EUV lithography equipment in their DRAM production, citing the steep cost of the tools and upcoming shifts in DRAM architecture. 3D DRAM Architecture Won’t ...

According to Wccftech, TSMC might delay its adoption of High-NA EUV, with the company expected to bypass the tool for its A14 process and instead continue using 0.33-NA EUV, a move revealed by Senior Vice President Kevin Zhang at the NA Technology Symposium and noted by BITS&CHIPS. Still, the...

As noted by Korean media outlet The Financial News, citing sources, Samsung Electronics brought in its first High-NA EUV equipment, the EXE:5000, to its Hwaseong campus earlier this month. This equipment, priced at approximately 500 billion KRW (around 500 million USD), is exclusively supplied by...

Shortly after confirming positive progress on its 18A node, with tape-outs set for 1H25, Intel also updated on its adoption of high-NA EUV equipment. On Monday, the company revealed that the first two high-NA EUV machines from ASML are in production, processing 30,000 wafers in a quarter already, as...

Though Intel plans to lower its 2025 capex to USD 20 billion from USD 24 billion in 2024, the semiconductor giant has been gearing up to receive its new high-NA EUV machine soon. According to a report from Dutch media outlet tweakers, the first modules of ASML’s TwinScan EXE:5200 will be delivered...