As Intel advances its High-NA EUV roadmap for its A14 node, market attention has turned to TSMC’s comparatively cautious approach to the cutting-edge lithography tool, which is estimated to cost around US$400 million per system. However, at its June 4 shareholder meeting, TSMC Chairman C.C. Wei...

While TSMC recently revealed that its upcoming A13 and A12 processes, both targeted for 2029, are not expected to require High-NA EUV lithography, ASML says the first chips produced using the technology may arrive soon. According to Reuters, ASML CEO Christophe Fouquet said the company expects to se...

One of the most closely watched issues in the semiconductor equipment space lately is TSMC’s statement that it does not plan to adopt High-NA EUV systems for its A13 node, scheduled around 2029. The move has sparked debate over whether—and to what extent—this decision could impact ASML’s fut...

Please note that this article cites information from imec, Reuters, Intel, SK hynix, Korea Economic Daily, Bloomberg, and The Elec. Belgian chip research institute imec announced that it has received an ASML tool that could advance next-generation chipmaking. According to its press release, imec ...

As TSMC, Intel, and Samsung kicked off 2nm mass production in late 2025, the spotlight is already shifting to their 1.4nm roadmaps and the rollout of ASML’s next-generation EUV lithography machines. According to Nikkei, citing ASML CEO Christophe Fouquet, Intel, Samsung, and SK hynix are expected ...