According to a report from ZDNet on July 15, Hanmi Semiconductor Chairman Kwak Dong-shin dismisses speculation that the company will adopt a hybrid bonder system for now, stating that Hanmi’s TC bonders are sufficient for HBM4 and HBM5, following JEDEC’s April decision to relax AI packaging thic...

Fresh off its inaugural overseas Foundry Direct Connect event in Seoul last week, Intel—keen to sharpen its lead in AI chips—is reportedly teaming up with SK hynix to co-develop next-generation AI accelerators, South Korea’s Newsis reports. At the Intel AI Summit on July 1, SK hynix VP Jung...

Fueled by a nearly 50% surge in HBM sales in the third quarter of fiscal 2025, Micron posted record revenue and is now eyeing another milestone. According to ZDNet, the U.S. memory giant aims to increase its HBM market share to 23–24% by the end of 2025. Notably, Micron said in its press releas...

As Samsung pushes to accelerate 1c DRAM development and regain ground in the HBM4 race, current leader SK hynix is pulling ahead with custom HBM solutions for tech giants. According to the Korea Economic Daily, its first customized HBM—likely HBM4E—is set to debut in the second half of 2026. ...

With hopes of turning the tide in the HBM4 era resting on its progress in 1c DRAM, Samsung has reportedly made a major leap in yield rates. According to Sedaily, the company recently achieved yields of 50–70% in tests for its sixth-generation 10nm-class DRAM (1c DRAM) wafers—a jump from the sub-...