As Samsung and SK hynix charge ahead in the HBM race, an unexpected player is said to be entering the arena from a different angle. LG Electronics is reportedly making a bold push into the semiconductor equipment space by developing hybrid bonders for HBM, according to Sedaily. Sedaily suggests a...

As leading memory makers advance in HBM development, cooling technology is expected to become a key competitive factor once HBM5 enters commercialization—likely around 2029—according to Joungho Kim, a KAIST professor cited by The Elec. As noted in the report, Kim explains that while packaging...

According to ZDNet, South Korea’s Ministry of Trade, Industry and Energy (MOTIE) announced that semiconductor exports—the nation’s top export item—hit a record high in May, totaling USD 13.8 billion. This marks a 21.2% increase compared to the same month last year. The surge was largely fuel...

As China races to localize AI chips and memory, rumors are mounting that Washington may tighten controls on its HBM production. According to Chinese media outlet EE Times China, Hanmi Semiconductor has informed Chinese clients it will halt shipments of TC bonders, crucial tools for stacking HBM chip...

As memory giants accelerate development in HBM4 and high-layer NAND, hybrid bonding technology is drawing heightened attention. South Korean leaders Samsung Electronics and SK hynix remain behind in key patents, according to a report from ZDNet. The report highlights that Samsung and SK hynix have d...